10MPa 8MPa PUR Adhesive Glue Electronic Component Glue For Enclosure Sealing

Electric Pur Hot Melt Glue / PUR Hot Melt Glue For Electronics / PUR Electronics

Product Descriptions:

BJ1015 is a solvent-free,reactive hot-melt polyurethane (HMPUR). It behaves fast strength built-up and high bonding strength in end, reworkable for repair.

Applications in Electronics:

• PCB Component Fixation – Secures connectors, capacitors, and wires before soldering.

• Wire Strain Relief – Prevents cable breakage at solder points.

• Enclosure Sealing – Protects sensitive electronics from dust/moisture ingress.

• Display & Touch Panel Assembly – Bonds layers without outgassing (unlike silicones).

• Battery Pack Assembly – Provides structural support and vibration resistance.

Characteristics:

BJ1015 showed great and balanced adhesion to PC,ABS, glass, metal and etc.

BJ1015 strength built-up fast, it reaches 1MPa within 20min after bonded.

High cured strength:BJ1015 after cured showed high strength on PC and ABS

both in shear and pulling force.

Re-workable:This product after cured can be re-workable by heat it to certain

temperature,the glue line shows elasticity properties.

Good work ability : BJ1015 can be applied by extruding bead and spray.

Good thermos-stability: This product showed termo-stability during long heat,less

15% increase in viscosity after heated at 110C for 6 hours

Specification:

8MPa PUR Adhesive Glue

Enclosure Sealing PUR Adhesive Glue

10MPa Electronic Component Glue

10MPa 8MPa PUR Adhesive Glue Electronic Component Glue For Enclosure Sealing Images