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Beige Electronics Hot Melt Adhesive Glue PCB Component Glue High Strength

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Beige Electronics Hot Melt Adhesive Glue PCB Component Glue High Strength

Brand Name : KAWAURA

Model Number : BJ1015

Certification : SGS

Place of Origin : CHINA

MOQ : 50PCS

Price : 40-60RMB/PCS

Payment Terms : T/T

Supply Ability : 3T

Delivery Time : 5-8 DAYS

Packaging Details : 30ml/pcs

(Viscosity@150 oC) : 3000±1000cps

Appl. Temp : 110℃

Color : Beige

GB/T528-2009 : 10MPa

ABS-ABS (GB/T528-2009 : 8MPa

elongation ASTM638 : >1000%

Open time @23℃ : 6-8min

color : white

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Electric Pur Hot Melt Glue / PUR Hot Melt Glue For Electronics / PUR Electronics

Product Descriptions:

BJ1015 is a solvent-free,reactive hot-melt polyurethane (HMPUR). It behaves fast strength built-up and high bonding strength in end, reworkable for repair.

Applications in Electronics:

  • PCB Component Fixation – Secures connectors, capacitors, and wires before soldering.

  • Wire Strain Relief – Prevents cable breakage at solder points.

  • Enclosure Sealing – Protects sensitive electronics from dust/moisture ingress.

  • Display & Touch Panel Assembly – Bonds layers without outgassing (unlike silicones).

  • Battery Pack Assembly – Provides structural support and vibration resistance.

Characteristics:

BJ1015 showed great and balanced adhesion to PC,ABS, glass, metal and etc.

BJ1015 strength built-up fast, it reaches 1MPa within 20min after bonded.

High cured strength:BJ1015 after cured showed high strength on PC and ABS

both in shear and pulling force.

Re-workable:This product after cured can be re-workable by heat it to certain

temperature,the glue line shows elasticity properties.

Good work ability : BJ1015 can be applied by extruding bead and spray.

Good thermos-stability: This product showed termo-stability during long heat,less

15% increase in viscosity after heated at 110C for 6 hours

Specification:

(Viscosity@150 oC) 3000±1000cps
Appl. Temp 110℃
Open time @23℃ 6-8min


Product Tags:

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